Advanced Flip Chip Packaging
Robert Lanzone (auth.), Ho-Ming Tong, Yi-Shao Lai, C.P. Wong (eds.)Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
Kategori:
Tahun:
2013
Edisi:
1
Penerbit:
Springer US
Bahasa:
english
Halaman:
560
ISBN 10:
1441957685
ISBN 13:
9781441957689
File:
PDF, 21.82 MB
IPFS:
,
english, 2013
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